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Editorial Board


Mads Græsbøll Christensen
Aalborg University, Denmark

Associate Editors

Fabio Antonacci, Politecnico di Milano, Italy

Changchun Bao, Beijing University of Technology, China
Emmanouil Benetos, Queen Mary University of London, UK

Wai-Yip Geoffrey Chan, Queen University, Canada

Dan Chazan, IBM, Israel
Jingdong Chen, Northwestern Polytechnical University, China
Maximo Cobos, School of Engineering of the Universitat de Valencia, Spain

Christophe D'Alessandro, CNRS, France

Héctor Delgado Flores, EURECOM, France

Christine Evers, Imperial College London, UK

Horacio Franco, SRI International Research Institute, US

Qian-Jie Fu, House Ear Institute, US

W S Gan, Nanyang Technological University, Singapore

Panayiotis G. Georgiou, USC Viterbi School of Engineering, US

Daniele Giacobello, SONOS INC., Advanced Technologies, US

Philippe Gournay, University of Sherbrooke, Canada

Phil Green, University of Sheffield, UK

Rodrigo Capobianco Guido, São Paulo State University, Brazil

Richard Heusdens, Delft University of Technology, The Netherlands

Jesper Rindom Jensen, Aalborg University, Denmark

Minje Kim, Indiana University Bloomington, US

Kate Knill, Cambridge University, UK

Yves Laprie, LORIA, France

Andreas Nautsch, EURECOM, France

T V Sreenivas, Indian Institute of Science, India

Bob Sturm, Queen Mary University of London, UK

Yannis Stylianou, Foundation for Research and Technology - Hellas (FORTH), Greece

Tomoki Toda, Nara Institute of Science and Technology, Japan

Wenwu Wang, University of Surrey, UK

Toon van Waterschoot, Katholieke Universiteit Leuven, Belgium

S Voran, Institute for Telecommunication Sciences, US

Xiaolei Zhang, Northwestern Polytechnical University, China

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